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Washington offers US$200 million to boost American smartphone industry in Indo-Pacific

scmp.com

Thursday, February 19, 2026

1 min read
Washington offers US$200 million to boost American smartphone industry in Indo-Pacific
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The US State Department will subsidise companies to roll out cheap smartphones running American software in the Indo-Pacific region, part of its “Pax Silica” initiative that seeks to shore up the resilience of the US artificial intelligence supply chain and win the AI race with China. The US has ...

The US State Department will subsidise companies to roll out cheap smartphones running American software in the Indo-Pacific region, part of its “Pax Silica” initiative that seeks to shore up the resilience of the US artificial intelligence supply chain and win the AI race with China. The US has launched the Edge AI Package, which provides up to US$200 million of funding for mobile network operators and smartphone vendors to deploy “low-cost, high-performance” handsets in some partner nations in...

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